METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE

摘要

PURPOSE: An electronic device, a printed circuit board, a manufacturing method thereof are provided to electrically connects a land of a first substrate and a land of a second substrate by pressing electrical conducting material to a laminating direction of the second substrate and the first substrate. CONSTITUTION: A bonding layer(50) is adhered to a first substrate(10A) and a second substrate(10B). The first substrate and the second substrate are electrically connected through electrical conducting material(16). The first substrate has base material(20), a through hole(11), hole filling-up material(12), and a wiring pattern(13). A projection part(15) is formed by using an end part(12A) of the hole filling-up material. The projection part is composed of a copper foil layer(31), a copper plating layer(32), and cover plating layer(33).