| 摘要 |
A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers. |
