| 摘要 |
<p>Method for the sealed assembly of an electronic housing containing one or more electronic components, the method including: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture including a paste and nanoparticles in suspension in said paste, the size of the nanoparticles ranging from 10 to 30 nm; and closing the housing in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.</p> |
