发明名称 Complex Heat Emitting Plate for LED Lighting Device and The LED Lighting Device Using The Same
摘要 PURPOSE: A complex heat radiation plate and an LED lamp including the same are provided to multiply efficiency for heat dissipation by maximizing a heat radiating area in a small space. CONSTITUTION: A plane heat radiation plate(10) is formed by laminating a copper layer on both sides of a substrate. The copper layer transfers heat of high temperatures generated in a light-emitting diode module(30) to an embossed heat radiation plate(20). The embossed heat radiation plate is composed of a plurality of protrusion units and a concave groove unit. The copper layer is evaporated at the bottom of the embossed heat radiation plate. The light-emitting diode module is attached to the lower end surface of the plane heat radiation plate.
申请公布号 KR20120055996(A) 申请公布日期 2012.06.01
申请号 KR20100117491 申请日期 2010.11.24
申请人 SONIX JAPAN INC. 发明人 KIM, YOUNG CHUL
分类号 F21V29/00;F21Y101/02 主分类号 F21V29/00
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