发明名称 |
METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE USING A LASER BEAM |
摘要 |
PURPOSE: A flexible electronic device manufacturing method using laser, a flexible electronic device, and a flexible substrate are provided to arrange an electronic substrate on a separation surface which has a surface roughness approximately equal to the surface roughness of a flexible motherboard, thereby easily solving a surface roughness problem of the flexible substrate. CONSTITUTION: A flexible substrate(200) is formed on a motherboard(100). The flexible substrate is separated from the motherboard. A carrier substrate in which a laser ablation layer is formed is attached to one surface of the flexible substrate. An electronic device is formed on a separation surface of the flexible substrate. The flexible substrate is separated from the carrier substrate.
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申请公布号 |
KR20120055997(A) |
申请公布日期 |
2012.06.01 |
申请号 |
KR20100117494 |
申请日期 |
2010.11.24 |
申请人 |
POSTECH ACADEMY-INDUSTRY FOUNDATION |
发明人 |
LEE, JONG LAM;KIM, KEE SOO;HONG, KEE HYEON;KIM, SUNG JUN;LEE, ILL HWAN;KOO, BON HYEONG |
分类号 |
H01L51/56 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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