发明名称 METHOD OF MANUFACTURING FLEXIBLE ELECTRONIC DEVICE, FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE SUBSTRATE USING A LASER BEAM
摘要 PURPOSE: A flexible electronic device manufacturing method using laser, a flexible electronic device, and a flexible substrate are provided to arrange an electronic substrate on a separation surface which has a surface roughness approximately equal to the surface roughness of a flexible motherboard, thereby easily solving a surface roughness problem of the flexible substrate. CONSTITUTION: A flexible substrate(200) is formed on a motherboard(100). The flexible substrate is separated from the motherboard. A carrier substrate in which a laser ablation layer is formed is attached to one surface of the flexible substrate. An electronic device is formed on a separation surface of the flexible substrate. The flexible substrate is separated from the carrier substrate.
申请公布号 KR20120055997(A) 申请公布日期 2012.06.01
申请号 KR20100117494 申请日期 2010.11.24
申请人 POSTECH ACADEMY-INDUSTRY FOUNDATION 发明人 LEE, JONG LAM;KIM, KEE SOO;HONG, KEE HYEON;KIM, SUNG JUN;LEE, ILL HWAN;KOO, BON HYEONG
分类号 H01L51/56 主分类号 H01L51/56
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