| 摘要 |
PURPOSE: A lead frame for a semiconductor package and a manufacturing method thereof are provided to increase the thickness of a substrate source material for performing a secondary upper etching process, thereby easily forming a fine circuit pattern layer. CONSTITUTION: A resist for coating a first top surface is coated on the top surface(102) of a substrate(101). A resist for coating a first bottom surface is coated on the bottom surface(103) of the substrate. A first bottom surface plating layer(107) is patterned on the bottom surface of the substrate. The substrate in which the first bottom surface plating layer is formed is filled with a resin(109). A first top surface plating layer(112) is patterned on the top surface of the substrate. |
