LIGHT EMITTING DIODE PACKAGE AND MANUFATURING METHOD THEREOF

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to reduce a stripping or separation between components using a mold which has a structure with reduced physical strength with a lens part. CONSTITUTION: A package main body(210) comprises a first lead frame(221) and a second lead frame(222). A light emitting diode chip(230) is mounted on the first lead frame. The light emitting diode chip and the second lead frame are bonded with a wire(240). A lens part(260) is formed using a first mold(310) and a second mold(320). The first mold comprises a penetration hole(311) which is formed at a position corresponding to a molding part(250).