PURPOSE: A semiconductor package is provided to suppress noise due to crosstalk between semiconductor chips by discharging electromagnetic waves created from first and second semiconductor chips through a ground part. CONSTITUTION: A substrate(110) comprises a plurality of penetration holes and a plurality of circuit patterns. A connection terminal(111) is formed on the lower surface of the substrate by being electrically connected to an external device. A first redistribution layer(121) is formed on the lower surface of a first semiconductor chip(120). A first connection member(140) electrically connects the substrate and the first semiconductor chip. A second semiconductor chip is electrically connected to the first semiconductor chip using a second connection member(150).
