发明名称 SILICONE RESIN, SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a silicone resin excellent in transparency and heat resistance, and having both thermoplasticity and thermosetting property, and to provide a sealing material comprising the silicone resin, and an optical semiconductor device in which the sealing material is used. <P>SOLUTION: A sealing material comprising a silicone resin, obtained by allowing a cage octasilsesquioxane having a group represented by formula (1), to react with an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane in the presence of a hydrosilylation catalyst, is used for sealing an optical semiconductor device. (In the formula, R<SP POS="POST">1</SP>represents a monovalent hydrocarbon group; R<SP POS="POST">2</SP>represents hydrogen or a monovalent hydrocarbon group, provided that the molar ratio of the monovalent hydrocarbon group: hydrogen in R<SP POS="POST">2</SP>as an average value in the cage octasilsesquioxane as a whole, is in a range of 6.5:1.5 to 5.5:2.5). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012102167(A) 申请公布日期 2012.05.31
申请号 JP20100249094 申请日期 2010.11.05
申请人 NITTO DENKO CORP 发明人 FUJII HARUKA;KATAYAMA HIROYUKI
分类号 C08L83/07;C08G77/44;C08L83/05;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/07
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