| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the weight of a heat-conducting material well by composing the heat-conducting material so that a good heat conductivity can be obtained when the heat-conducting material is implemented while being compressed although a good heat conductivity cannot be obtained when the heat-conducting material is not compressed. <P>SOLUTION: The heat-conducting material 1 is composed by filling an elastomer 3, shaped as foam having successive bubbles 3A, with a thermally conductive filler 5. Heat conductivity of the heat-conducting material 1 is 0.3 W/(mK) or lower when it is not compressed, and when it is compressed by 20% in the uniaxial direction, heat conductivity in the uniaxial direction is 1.0 W/(mK) or higher. When the heat conductivity is 0.4 W/(mK) or lower, the heat-conducting material is insufficient to be used for thermal countermeasure of an electronic component, but when the heat conductivity is 1.0 W/(mK) or higher, it is sufficient to be used for thermal countermeasure of an electronic component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
