| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which reliably performs bump joining between a solid state imaging device and metal wiring and improves yield. <P>SOLUTION: An imaging apparatus includes a sensor chip 5 having a light receiving surface 8 which receives incident light and a glass substrate 6 disposed on the light receiving surface 8 side. The glass substrate 6 includes a resin layer 40 formed on a glass substrate body 39 and a conductor pattern 41 formed on a surface of the resin layer 40. The sensor chip 5 is joined to the conductor pattern 41 through bumps. <P>COPYRIGHT: (C)2012,JPO&INPIT |
