| 摘要 |
This electronic component has a laminated body, which is composed of a plurality of insulator layers having a conductor pattern formed respectively thereon, and an amplifier-use semiconductor device that is mounted on mounting electrodes provided on the top surface of the laminated body. A first ground electrode is formed on an insulator layer that is positioned close to the top surface of the laminated body, and a second ground electrode is formed on an insulator layer that is positioned close to the bottom surface of the laminated body. The first ground electrode is connected to the mounting electrodes using a plurality of via holes; a conductor pattern for configuring a first circuit block is provided in the area that is formed between the first ground electrode and the second ground electrode and below the amplifier-use semiconductor device; and at least a portion of the conductor pattern, which is used as a wire for connecting the first circuit block with the amplifier-use semiconductor device, is positioned on the insulator layer that is interposed between the mounting electrodes and the first ground electrode. |
