SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

摘要

Provided are semiconductor devices and methods of manufacturing the same. The semiconductor device may include a substrate provided with a transistor, an insulating layer disposed on the substrate, the insulating layer including a contact hole exposing a portion of the transistor, a spacer disposed on an inner sidewall of the contact hole, and a contact plug disposed in the contact hole. Here, a space defined by the spacer may increase in width from a bottom side thereof to a top side thereof.