| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a division method of an optical device wafer capable of highly efficiently dividing an optical device wafer into individual optical devices and preventing optical device brightness from deteriorating. <P>SOLUTION: A method for dividing the optical device wafer 11 formed by partitioning a plurality of optical devices 19 on a surface of a sapphire substrate by division schedule lines 17 comprises: a step of sticking a plate having rigidity to a surface of the optical device wafer via an ultraviolet curable bond agent or wax; a step of forming a modified layer 23 inside the substrate corresponding to the division schedule lines by positioning a focusing point of a laser beam of a wavelength having transmissivity at a location inside the substrate corresponding to the division schedule lines and irradiating the sapphire with the laser beam from the surface or rear face of the wafer before or after the sticking step; and a step of applying an external force to the substrate after grinding the rear face of the substrate, dividing the optical device wafer into individual optical devices using the modified layer formed inside the substrate as a division starting point, and grinding the sapphire substrate thinly till the modified layer is removed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
