| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire saw device for cutting an ingot or the like into a plurality of wafers, and to provide a method for manufacturing wafers using the same. <P>SOLUTION: The wire saw device includes: wire holding rollers 11, 12 each including a holding portion on the outer circumference, the holding portion holding a wire W for cutting a plurality of workpieces 50 in a parallel condition so as to correspond to the thickness of a wafer after cutting; at least two auxiliary rollers 15, 16 disposed between the wire holding rollers so as to form a plurality of work cutting portions for simultaneously cutting the plurality of workpieces 50 between the wire holding rollers; and a base on which the wire holding rollers and the auxiliary rollers are mounted. An auxiliary roller moving mechanism 40 is provided between the base and the auxiliary rollers, and the wire is oscillated so that the inclination of the wire in the work cutting portion is successively changed through the auxiliary roller moving mechanism without changing the wire length for one round to be laid over the wire holding rollers and the auxiliary rollers. <P>COPYRIGHT: (C)2012,JPO&INPIT |
