| 摘要 |
A flexible substrate layer haying metallic bus-lines and connecting stitches is formed. A trace layer haying electrical traces and thermal vias is also formed. The substrate layer and the trace layer are bonded together by way of respective thermal pathways and electrically interconnected. The resulting layer-wise assembly is configured to support and electrically interconnect an array of photovoltaic cells and to channel away heat during operation.
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