| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce thermal resistance of power semiconductor modules and radiators and to provide a power conversion device with further reduced size. <P>SOLUTION: A power conversion device of the present invention comprises first power semiconductor modules 1 bonded to a first surface of a first radiator 5 via first bonding materials 3, and a second power semiconductor modules 2 bonded to a first surface of a second radiator 6 via second bonding materials 4. The first radiator 5 and the second radiator 6 are disposed so that their second surfaces, which are the surfaces opposite to the surfaces to which the first and second power semiconductor modules 1 and 2 are bonded, are faced to each other, and coolant serially flows through the first radiator 5 and the second radiator 6. <P>COPYRIGHT: (C)2012,JPO&INPIT |
