发明名称 MOLTEN METAL PLATING FACILITY
摘要 <P>PROBLEM TO BE SOLVED: To provide a molten metal plating facility, which enables a gas wiping device to be installed with both an edge up reducing device and a static pressure generating device to uniformize the plate application amount. <P>SOLUTION: The molten metal plating facility with the gas wiping device includes: cushion pads 12a, 12b that are provided in the vicinity of wiping nozzles 11a, 11b and cause wiping gas sprayed from the wiping nozzles to be accompanied by atmosphere gas to generate a static pressure along a running direction of a strip S; baffle plates 13a, 13b that are integrally assembled to the cushion pads and reduces the occurrence of edge up of a plate end part in the strip; and a first movement mechanism constituted of LM guides 18a, 18b for moving the cushion pads in a plate width direction of the strip and baffle plate position adjustment cylinders 22a, 22b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012102389(A) 申请公布日期 2012.05.31
申请号 JP20100254496 申请日期 2010.11.15
申请人 MITSUBISHI-HITACHI METALS MACHINERY INC 发明人 FUJIOKA HIRONORI;YONEKURA TAKASHI;YOSHIKAWA MASASHI
分类号 C23C2/00;C23C2/16;C23C2/26;C23C2/40 主分类号 C23C2/00
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