| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing semiconductor having an adhesive layer exhibiting excellent followability for a semiconductor wafer and fracturability during expansion, and to provide a packaging method of a semiconductor chip using the adhesive sheet for processing semiconductor. <P>SOLUTION: The adhesive sheet for processing semiconductor is used continuously in a series of steps for individualizing a semiconductor wafer after thinning to produce a semiconductor chip, and flip-chip mounting the semiconductor chip on a circuit board or other semiconductor chip. The adhesive sheet has an adhesive layer and a base material layer. The adhesive layer contains an epoxy resin, a hardener and an inorganic filler. Storage modulus measured by a dynamic viscoelastic measurement apparatus is within a range of 40-70 MPa at temperatures from -15°C to 10°C, and within a range of 0.01-0.2 MPa at temperatures of 70-80°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
