| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus that can deposit a uniformed film across the full width of a substrate. <P>SOLUTION: There is provided the film deposition apparatus (200) that conveys a substrate conveyance body (202) having a width narrower than that of the substrate (101) while bringing the substrate conveyance body into contact with a back surface of the substrate (101) and also deposits a film on a surface of the substrate (101) passing by the substrate conveyance body (202) via a shutter (106) having a window (106a) with a width larger than that of the substrate (101), thereby depositing the uniformed film across the full width of the substrate (101). <P>COPYRIGHT: (C)2012,JPO&INPIT |
