发明名称 ELECTRONIC DEVICE AND PRINTED BOARD MODULE
摘要 <P>PROBLEM TO BE SOLVED: To improve dust resistance of a printed board module and also to reduce its size. <P>SOLUTION: A printed board module 130 comprises: a key flexible board 140; metal domes arranged on the key flexible board 140; and a top tape 160. The top tape 160 comprises: a front-face adhesive portion 163 which is adhered to the metal domes and a face of the key flexible board 140 provided with the metal domes; and folded portions 166 each of which extends from the front-face adhesive portion 163 and is folded back at an edge face of the key flexible board 140. The top tape 160 also has rear-face adhesive portions 168 each of which extends from each folded portion 166 and is adhered to the rear side of the face of the key flexible board 140 provided with the metal domes 132. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012104282(A) 申请公布日期 2012.05.31
申请号 JP20100250065 申请日期 2010.11.08
申请人 FUJITSU LTD;FUJITSU PERIPHERALS LTD 发明人 SAKURAI TOMONORI;SAKATA YOSHITAKA;KOBAYASHI CHIKARA;TAKAHASHI JIRO
分类号 H01H13/06;H01H13/702 主分类号 H01H13/06
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