| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a division method of an optical device wafer capable of highly efficiently dividing an optical device wafer into individual optical devices and preventing optical device brightness from deteriorating. <P>SOLUTION: A division method of an optical device wafer for dividing the optical device wafer into individual optical devices comprises: an adhesive tape sticking step of sticking an adhesive tape to a surface of the optical device wafer; a modified layer formation step of forming a modified layer inside the sapphire substrate corresponding to a division schedule line; a division step of applying an external force to the optical device wafer and dividing the optical device wafer into individual optical devices; a shape maintaining step of sticking a shape maintaining member to a rear face of the optical device wafer; a rigid plate sticking step of sticking a plate having rigidity to a surface of the optical device wafer; a shape maintaining member peeling step of exposing a rear face of the sapphire substrate by peeling the shape maintaining member from the rear face of the sapphire substrate; and a rear face grinding step of removing the modified layer by grinding the rear face of the sapphire substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
