| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately cut a wafer in a short time. <P>SOLUTION: A cutting device (500) for cutting a wafer (20), having a surface protection film (3) pasted on a surface (21), includes: by irradiation of laser with a light condensation point focused on the inside of the wafer, a laser processing unit (150) for forming a stripe shaped modification region (86) inside the wafer; a grinding unit (350) for grinding the rear face (22) of the wafer until reaching the modification region or the vicinity of the modification region; a dicing film paste unit (400) for combining the wafer with a mount frame (15) by pasting a dicing film (33) to the rear face of the wafer; a holding base (10) for holding the wafer and the mount frame; and a roller (60) for moving the wafer to a diameter direction while pressing the rear face of the wafer via the dicing film. By this configuration, the wafer is cut along the modification region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
