发明名称 HEAT RADIATION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiation structure which enhances heat radiation on a heat radiation surface and improves heat radiation efficiency. <P>SOLUTION: A heat radiation structure is composed of a cooling element 5 having an endotherm surface 6 joined to a surface of an electronic element 3 and a pedestal 11 which is connected with a heat radiation surface 7 side of the cooling element 5 and from which heat from the electronic element 3 is radiated. The pedestal 11 is composed of a metal plate member 13 which is larger than the area of the heat radiation surface 7 of the cooling element 5 and smaller than the superficial area of a substrate 2 and a heat conductive sheet 15 which is joined to the plate member 13 and is formed so as to be larger than the area of the heat radiation surface 7 of the cooling element 5 and smaller than the superficial area of the substrate 2. One surface of the heat conductive sheet 15 is joined to the plate member 13 and the other surface is joined to the heat radiation surface side of the cooling element 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012104554(A) 申请公布日期 2012.05.31
申请号 JP20100249853 申请日期 2010.11.08
申请人 FREESIA MAKUROSU KK 发明人 SASAKI BEJI
分类号 H05K7/20;H01L23/38 主分类号 H05K7/20
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