发明名称 |
SEMICONDUCTOR WAFER TRANSPORT METHOD AND SEMICONDUCTOR WAFER TRANSPORT APPARATUS |
摘要 |
A semiconductor wafer joined to a carrier via a double-faced adhesive tape having an adhesive layer of a heating separation property is heated for removal from the carrier. The double-faced adhesive tape is separated from the semiconductor wafer on a holding table. Thereafter, an air nozzle preliminarily cools the semiconductor wafer for a given time during transportation with a wafer transport section. Upon completion of the preliminary cooling, the semiconductor wafer is placed on a cooling stage to cool it to a target temperature.
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申请公布号 |
US2012132412(A1) |
申请公布日期 |
2012.05.31 |
申请号 |
US201113304135 |
申请日期 |
2011.11.23 |
申请人 |
YAMAMOTO MASAYUKI;HASE YUKITOSHI |
发明人 |
YAMAMOTO MASAYUKI;HASE YUKITOSHI |
分类号 |
G05D23/00;F28F9/00 |
主分类号 |
G05D23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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