METHOD FOR CURING AN ELECTRICALLY-CONDUCTIVE ADHESIVE AND A CONTACT POINT BETWEEN TWO JOINING PARTNERS

摘要

The invention relates to a method for curing an electrically-conductive adhesive (12) with electrically conductive particles, in which method the joining partners (14, 16) are heated, at a heating rate of more than 15 K/min and particularly more than 25 K/min, to a temperature of more than 180°C. By using a slow curing system, for example an amine curing agent, combined with the fact that the joining partners are heated very fast to temperatures of 180°C or more, the microstructure of the particles can be optimised in such a manner that continuous and relatively solid metallic, electrically and thermally-conductive paths (20) are produced. The invention additionally relates to the use of an electrically-conductive adhesive with electrically-conductive particles for contacting a power semiconductor to a circuit substrate.