发明名称 CMP SLURRY RECYCLING SYSTEM AND METHODS
摘要 The present invention provides a system and method for recycling an abrasive chemical mechanical polishing (CMP) slurry after polishing substrates therewith. The method comprises circulating the recovered CMP slurry from a blending tank through an ultrafiltration unit and back into the, the ultrafiltration unit removing a predetermined amount of water from recovered slurry to form a slurry concentrate; optionally adjusting the pH of the concentrate to a predetermined target level; and optionally adding selected additive chemical components and/or water to the concentrate in amounts sufficient to form a reconstituted CMP slurry that is suitable for use in a CMP process.
申请公布号 WO2012024374(A3) 申请公布日期 2012.05.31
申请号 WO2011US48044 申请日期 2011.08.17
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 AMOROSO, NICHOLAS;TOLLA, BRUNO;BOLDRIDGE, DAVID
分类号 H01L21/304 主分类号 H01L21/304
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