MOLD FOR LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A mold for an LED package is provided to prevent a leakage of a molding material for finishing the LED package, thereby improving quality of an LED. CONSTITUTION: A light emitting chip load part(1110) includes a cavity. A light emitting chip(1300) which is operated when a power source is applied is mounted on the cavity. A heat dissipation frame(1120) is arranged on the lower part of the light emitting chip load part. The heat dissipation frame comprises a penetration part. The penetration part has an extended rectangular shape.