| 摘要 |
PURPOSE: A heat sink is provided to improve productivity by decreasing a hole process for combining a circuit device. CONSTITUTION: A plurality of heat radiation fins(120) are vertically projected from one side of a support plate. A device insertion groove(150) is recessed in the other side of the support plate in a longitudinal direction. A device support unit(151) is protruded from a device insertion groove and supports the circuit device. The inside of the device support unit is inclined.
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