| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin laminate excellent in adhesion, fine pattern formation, and mold release. <P>SOLUTION: The photosensitive resin laminate includes: a base material 11; an etching layer 12 in which a metal layer 14 provided on the base material and a SiO<SB POS="POST">2</SB>layer 15 provided on the metal layer are laminated; and a resist layer 13 provided on the etching layer, which includes a cationic curable resin composition and a radical curable resin composition. The cationic curable resin composition includes a photoacid generator and at least one kind of a cationic curable monomer selected from a group consisting of an epoxy compound, an oxetane compound, and a vinyl ether compound. The radical curable resin composition includes: a radical curable monomer that is a (meta) acrylate derivative; a photoradical generating agent; and a prescribed urethane (meta) acrylate compound. Content of the urethane (meta) acrylate compound is 0.1 to 5 parts by weight with respect to a total of 100 parts by weight of a solid content of the cationic and the radical curable resin compositions. <P>COPYRIGHT: (C)2012,JPO&INPIT |
