| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor resin composition capable of being imidized with mild heat treatment conditions by bringing heating temperature in obtaining a polyimide from a polyimide precursor to be lower and curing promoting activity at the low temperature to be higher, and an article using the polyimide precursor resin composition, especially suitably, the article obtained by forming a part composed of the polyimide on an article with low heat resistance. <P>SOLUTION: The polyimide precursor resin composition contains a polyimide precursor and a base having a ≥150°C boiling point and ≤200°C melting point and a base selected from the group consisting of primary and secondary aliphatic amines having an alcoholic hydroxyl group and no acidic group included in a group consisting of a carboxyl group, a sulfo group and a phosphate group. The article, at least a part of it, is formed of the resin composition or its cured material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
