| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board in which a film thickness of a cover body covering an electrode can be uniformized. <P>SOLUTION: A printed wiring board 1 having a contact part 71 to be brought into contact with another conductor comprises: a base film 10; a first electrode 21 formed on the base film 10; an insulating layer 40 which has an opening 40a for exposing a part of the first electrode 21 and is formed on the base film 10; and a first conductive cover body 51 filling the opening 40a and covering the first electrode 21. The contact part 71 is composed of the first electrode 21 and the first cover body 51. <P>COPYRIGHT: (C)2012,JPO&INPIT |
