GIRD-ARRAY IC CHIP PACKAGE WITHOUT CARRIER AND MANUFACTURING METHOD THEREOF

摘要

A gird-array IC chip package without a carrier and a manufacturing method thereof are provided. The package includes inner pins (A,B,C,D), an IC chip (6), solder pads, bonding wires (7) and a molding encapsulant (8), wherein the inner pins are arranged in a multi-row matrix at the front face of the package; and exposed multi-row square-similar circular gold-plated pots (a,b,c,d) are arranged at the back face of the package; the IC chip is arranged on the inner pins; the inner pins are attached to the IC chip by an adhesive film piece (5); the pads on the IC chip are connected to the inner pins by bonding wires; the adhesive film piece, the IC chip, the bonding wires and the edges of the inner pins are surrounded by the molding encapsulant.