发明名称 OXIDE MEMS BEAM
摘要 In one embodiment, a semiconductor structure includes a beam positioned within a sealed cavity, the beam including: an upper insulator layer including one or more layers; and a lower insulator layer including one or more layers, wherein a composite stress of the upper insulator layer is different than a composite stress of the lower insulator layer, such that the beam bends.
申请公布号 US2012133006(A1) 申请公布日期 2012.05.31
申请号 US20100955220 申请日期 2010.11.29
申请人 HASSELBACH JOSEPH P.;LESTAGE KAREN L.;STAMPER ANTHONY K.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HASSELBACH JOSEPH P.;LESTAGE KAREN L.;STAMPER ANTHONY K.
分类号 H01L29/84 主分类号 H01L29/84
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