| 摘要 |
A thin film deposition apparatus is disclosed. In one embodiment, the apparatus includes i) a deposition source configured to discharge a deposition material, ii) a deposition source nozzle unit disposed at a side of the deposition source and comprising a plurality of deposition source nozzles arranged in a first direction and iii) a patterning slit sheet disposed opposite to the deposition source nozzle unit and comprising a plurality of patterning slits arranged in a second direction substantially perpendicular to the first direction. The patterning slit sheet may include: i) a base sheet, in which a plurality of sub-patterning slits are formed in the second direction and ii) a plurality of patterning bars disposed between adjacent sub-patterning slits to form the patterning slits. Further, the deposition apparatus is configured to perform deposition while the substrate is moved relative to the thin film deposition apparatus in the first direction. |
