发明名称 METHOD OF MOLDING HOLLOW RESIN MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of molding hollow resin molding preventing yield reduction due to defective molding and deterioration of a die by appropriately controlling a fluidized state of a molten resin to be injected into a cavity of the die and excellent in production efficiency and cost performance. <P>SOLUTION: A pressure sensor 18 is attached to the vicinity of a plurality of injection gates 19 of the joint forming cavity 15 into which the molten resin is injected, a temperature sensor 17 is attached to a resin final joining point in the joint forming cavity in which the molten resins injected from the injection gates are joined, resin filling to the resin final joining point is sensed based on a sensor signal from the temperature sensor and a filling pressure is monitored to control a pressure supplementing state of resin filling. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012101393(A) 申请公布日期 2012.05.31
申请号 JP20100250373 申请日期 2010.11.09
申请人 SHOWA KANAGATA KOGYO KK 发明人 NAKAMURA MASAMICHI;HIRAI AKIRA
分类号 B29C45/14;B29C45/26;B29C45/76;B29L22/00 主分类号 B29C45/14
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