发明名称 THERMALLY CONDUCTIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition having excellent thermal conductivity, a small specific gravity and flexibility. <P>SOLUTION: This thermally conductive resin composition contains a matrix resin, pitch-based carbon fibers or vapor-grown carbon fibers, and a foaming agent, and has a specific gravity of &le;1.1, and a thermal conductivity of &ge;0.4 W/(m-K). Such a thermally conductive resin composition can obtain a high thermal conductivity, a small specific gravity and flexibility. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012102263(A) 申请公布日期 2012.05.31
申请号 JP20100253003 申请日期 2010.11.11
申请人 KITAGAWA IND CO LTD 发明人 MORI TAKAYUKI;KONDO YASUO
分类号 C08J9/04;C08K3/04;C08K7/06;C08L21/00 主分类号 C08J9/04
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