| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding device having a bonding head capable of ensuring high output by arranging a plurality of light irradiation means on the outer periphery of the bonding head in order to ensure the amount of heat required for bonding of an electronic component. <P>SOLUTION: Following means are employed in the bonding device. Firstly, a bonding device comprises a bonding head 3 having a holding tool 2 for suction-holding an electronic component 4 at the tip, a light source 5 emitting light, and light guide means 6, 7 for guiding light irradiated from the light source to the holding tool, and heats the electronic component suction-held to the holding tool by irradiating with light at the time of bonding. Secondary, the light source is formed by arranging a plurality of light irradiation means on the outer periphery of the bonding head. Thirdly, the light irradiation means irradiate light inward from the outer periphery of the bonding head. <P>COPYRIGHT: (C)2012,JPO&INPIT |
