| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated wafer free from lamination defects such as voids, blister, or the like, and to provide a method of manufacturing the same. <P>SOLUTION: In the method of manufacturing a laminated wafer, surface of the insulating film of a wafer for active layer and surface of a wafer for supporting are polished immediately before the wafer for active layer and the wafer for supporting are laminated. The laminated wafer is obtained by laminating the wafer for active layer and the wafer for supporting, where the surface on the interface side has a low surface roughness. <P>COPYRIGHT: (C)2012,JPO&INPIT |
