TEST APPARATUS, CIRCUIT MODULE AND MANUFACTURING METHOD

摘要

An apparatus comprising a test circuit that is provided on a test substrate and tests the device under test; a sealing section that covers a region of the test substrate on which the test circuit is formed, and seals the test circuit to form a sealed space that is filled with a cooling agent; and a through-connector that passes through the sealing section and electrically connects the test circuit to an element provided outside the sealing section, such that the connection is not through the test substrate.