| 发明名称 |
Thin-Layer Encapsulation for an Optoelectronic Component, Method for the Production Thereof, and Optoelectronic Component |
| 摘要 |
A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.
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| 申请公布号 |
US2012132953(A1) |
申请公布日期 |
2012.05.31 |
| 申请号 |
US201013260560 |
申请日期 |
2010.03.22 |
| 申请人 |
BECKER DIRK;DOBBERTIN THOMAS;LANG ERWIN;REUSCH THILO |
发明人 |
BECKER DIRK;DOBBERTIN THOMAS;LANG ERWIN;REUSCH THILO |
| 分类号 |
H01L23/28;H01L21/56;H01L51/44;H01L51/52 |
主分类号 |
H01L23/28 |
| 代理机构 |
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