发明名称 RESONANCE OPTIMIZED BONDING WIRE WITH A SIGMOID SHAPED LOOP
摘要 Any two segments of a wire bonded on two bond pads at different elevations can be distinguished by a stationary node (or zero-displacement) during its second-mode vibration. In order to boost the natural frequency of such a bond wire to avoid a second-mode resonance occurring at the lowest frequency in the in-plane vibration, a wire can be optimized by connecting two equalized (shortest possible) wire segments to replace a wire consisting of a larger segment and a shorter segment. The purpose is to re-distribute a larger vibration movement in the longer segment with a lower stiffness of an arbitrary bond wire to two smaller equalized segments of an optimized wire to reduce an in-plane vibration to significantly improve the wire natural frequency and reliability in a harsh vibration environment such as over 30 kHz.
申请公布号 WO2011143549(A3) 申请公布日期 2012.05.31
申请号 WO2011US36423 申请日期 2011.05.13
申请人 CONTINENTAL AUTOMOTIVE SYSTEMS, INC.;CHIOU, JEN-HUANG, ALBERT 发明人 CHIOU, JEN-HUANG, ALBERT
分类号 H01L23/48;G01L9/00;G01L9/06 主分类号 H01L23/48
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