| 摘要 |
<p>Provided is a polyamide resin having high heat resistance, excellent moldability and excellent mechanical properties. A polyamide resin comprising a diamine unit which contains 70 mol% or more of a xylylene diamine unit comprising 50-95 mol% of paraxylylene diamine and 50-5 mol% of metaxylylene diamine and a dicarboxylic acid unit which contains 70 mol% or more of a linear aliphatic dicarboxylic acid unit comprising 50-100 mol% of adipic acid and 0 mol% or greater but less than 50 mol% of sebacic acid or another linear aliphatic carboxylic acid, wherein the polyamide resin is characterized in that the molar ratio of the reacted diamine unit to the reacted dicarboxylic acid unit ((the molar number of the reacted diamine units)/(the molar number of the reacted dicarboxylic acid units)) is less than 0.994 and the polyamide resin has a number average molecular weight of 10,000-25,000 and a melting point of 285°C or higher.</p> |
