| 摘要 |
PURPOSE: A wafer level package and a manufacturing method thereof are provided to improve junction reliability between an outer connector and a redistribution line structure by including a buffer pad which disperses stress transferred from the outer connector. CONSTITUTION: A redistribution line structure(146) rearranges a junction pad(112). The redistribution line structure comprises a connection via(146a), a buffer pad(146b), and a circuit wire(146c). The connection via is connected to the junction pad. An outer connector(160) is welded on the buffer pad. The circuit wire connects the connection via and the buffer pad. |
