| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly reduce damage on electronic components during resin sealing, in an electronic device, in which a heat sink provided on an outer side on both ends of the electronic components is sealed with resin by a transfer mold method. <P>SOLUTION: In an electronic device manufacturing method, an integrating member 110 provided with heat sinks 20, 30 on outer sides of both ends 11, 12 of an electronic component 10 is put in a mold 100, and sealed with a resin 40. A recess 1 continuously formed from an inner periphery of an outer surface 22 of a first heat sink 20 to an end surface 23 is provided on the outer surface 22. In a resin sealing step, the resin 40 flows not only between the inner surfaces 21, 31 of both of the heat sinks 20, 30, but also toward the outer surface 22 of the first heat sink 20, so that the recess 1 is filled with the resin 40. <P>COPYRIGHT: (C)2012,JPO&INPIT |
