| 摘要 |
<P>PROBLEM TO BE SOLVED: To adjust a nozzle position to supply a coating liquid accurately and promptly, without dependent on the skill of an operator, when performing coating processing on a substrate by a coating processing device. <P>SOLUTION: A method for adjusting the position of a coating liquid nozzle 33 to supply the coating liquid to a wafer includes: moving the coating liquid nozzle 33 to the upward of the center portion of a spin chuck 20 which is in a state that the wafer is not held; thereafter, imaging a suction port 20a corresponding to the center portion of the spin chuck 20 and the tip portion of the coating liquid nozzle 33 by CCD cameras 50, 51; and in the imaged image, adjusting the position of the coating liquid nozzle 33 so as to make the position of the center of the tip portion of the coating liquid nozzle 33 in the horizontal direction coincident with the position of the suction port 20a, which is the center portion of the spin chuck 20 in the horizontal direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
