发明名称 CAMERA MODULE
摘要 PURPOSE: A camera module is provided to fix by an adhesive due to adhesive injection hole and have a uniform mounting height by directly surface-contacting on the lower surface of a lens assembly and upper surface of an image sensor. CONSTITUTION: A camera module comprises a printed circuit board(10), an image sensor(20), a housing(40), and a lens assembly(30). The image sensor is installed on the printed circuit board and comprises photographing elements to convert lights into electric signals. The housing comprises a hole in the upper central part. The lens assembly is placed by being contacted in the upper part of the image sensor. The lens assembly housed in the internal space of the housing comprises one or more lens aligned in the hole and a hole filled with an adhesive(50) in the lower part of an external wall.
申请公布号 KR20120054982(A) 申请公布日期 2012.05.31
申请号 KR20100116417 申请日期 2010.11.22
申请人 LG INNOTEK CO., LTD. 发明人 LEE, KI HO
分类号 G03B17/02;G03B3/02;H04N5/225 主分类号 G03B17/02
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