| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently remove a protective tape without breaking a semiconductor wafer. <P>SOLUTION: A projection part 12 projecting toward radial outside of a wafer 10 is formed on one part of an outer periphery 10A of the wafer 10 before a grinding step. A peeling tape 20 is overlaid on the projection part 12 formed on the outer periphery 10A of the wafer 10, and adhered so that the projection part 12 is at a peeling start position P1. When the protective tape 14 is peeled together with the peeling tape 20, the location of the projection part 12 of the wafer 10 at the peeling start position P1 reduces an adhesion area of the projection part 12 and the protective tape 14, thereby reducing adhesion of the protective tape 14 and the wafer 10. Therefore, the protective tape 14 can be easily peeled from the wafer 10, and a force applied to the wafer 10 is reduced, so that the wafer 10 can be efficiently peeled without breaking the wafer 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
