| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic component mount substrate which reduces breaking in a solder joint part caused by influence of heat strain due to heat generated by an electronic component mounted on a surface of a substrate in which a wiring pattern is formed and suppresses inclination of the electronic component during solder joint. <P>SOLUTION: In an electronic component mount substrate 3, an electronic component 2 is mounted on a surface of a substrate 1 in which a wiring pattern 4 is formed by solder joint. In the electronic component mount substrate 3, a heat resistant tape 6 is disposed at a position on the substrate 1, which is located between the substrate 1 and the electronic component 2 and excludes a solder joint part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
