| 摘要 |
The present invention relates to a method of manufacturing an LED module. The method of manufacturing the LED module includes: preparing a first package in which an LED chip is mounted inside a housing, wherein a first phosphor is coated within the housing in which the LED chip is mounted, and the first package has a blue or white-based color coordinate and a color temperature of about 10,000°K to about 16,000°K (Kelvin temperature); performing a plasma-cleaning process for removing moisture, an oxide layer, and foreign substances from a top surface of the first phosphor of the first package; and coating a second phosphor on the top surface of the first phosphor of the first package in which the plasma cleaning process is performed to form a second package in which the color temperature and color coordinate of the first package are changed. According to the present invention, the color temperature and color coordinate may be changed using the phosphor to recycle the LED package and reduce manufacturing costs of the LED module for lighting or advertising purposes. |
